公开(公告)号：US20210159155A1

公开(公告)日：2021-05-27

申请号：US16693193

申请日：2019-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Cheng HSU ,  Chih-Hung HSU ,  Mei-Lin HSIEH ,  Yuan-Chun CHEN ,  Yu-Shun HSIEH ,  Ko-Pu WU ,  Chin LI HUANG

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.