公开(公告)号：US20240413061A1

公开(公告)日：2024-12-12

申请号：US18207087

申请日：2023-06-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： An-Hsuan HSU ,  Cheng-Yuan KUNG ,  Yaohsin CHOU

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/18

Abstract: A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending from the wiring structure and contacting the first nanowire bundle. The wire bundle structure is configured to reduce a variation in a distance of a gap between the substrate and the wiring structure.