公开(公告)号：US20230092873A1

公开(公告)日：2023-03-23

申请号：US17483720

申请日：2021-09-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chanyuan LIU ,  Kuo-Hsien LIAO ,  Yu-Hsiang SUN

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors.