公开(公告)号：US11515237B2

公开(公告)日：2022-11-29

申请号：US17264792

申请日：2019-07-29

Applicant: Agency for Science, Technology and Research

Inventor： Gongyue Tang ,  Kazunori Yamamoto ,  Xiaowu Zhang

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/18 ,  H05K7/20 ,  H01L23/495 ,  H01L23/538 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H01L23/367 ,  H01L23/473

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.