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1.
公开(公告)号:US06962524B2
公开(公告)日:2005-11-08
申请号:US10642128
申请日:2003-08-15
申请人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
IPC分类号: B23H5/00 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , C25D17/00 , C25D17/10 , H01L21/321 , B24D11/02
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
摘要翻译: 提供球组件的实施例。 在一个实施例中,球组件包括壳体,球,导电适配器和接触元件。 壳体具有延伸到内部通道的第一端的环形座。 导电适配器联接到壳体的第二端。 接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。
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2.
公开(公告)号:US07207878B2
公开(公告)日:2007-04-24
申请号:US11031545
申请日:2005-01-08
申请人: Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人: Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
IPC分类号: B24D11/00
CPC分类号: B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译: 提供了用于处理基板的抛光制品的实施例。 在一个实施例中,用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层具有适于抛光衬底的暴露表面。 织物层可以是编织的或非织造的。 导电层可以由软金属构成,并且在一个实施例中,暴露的表面可以是平面的。
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3.
公开(公告)号:US06991528B2
公开(公告)日:2006-01-31
申请号:US10455941
申请日:2003-06-06
申请人: Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人: Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
CPC分类号: B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译: 提供了用于处理基板的抛光制品的实施例。 在一个实施例中,用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层具有适于抛光衬底的暴露表面。 织物层可以是编织的或非织造的。 导电层可以由软金属构成,并且在一个实施例中,暴露的表面可以是平面的。
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公开(公告)号:US07790015B2
公开(公告)日:2010-09-07
申请号:US11930495
申请日:2007-10-31
申请人: Yan Wang , Antoine P. Manens , Siew S. Neo , Alain Duboust , Liang-Yuh Chen
发明人: Yan Wang , Antoine P. Manens , Siew S. Neo , Alain Duboust , Liang-Yuh Chen
CPC分类号: H01L21/32134 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/04 , B24B49/10 , B24B49/16 , G01N1/32 , H01L21/32125 , H04N1/00
摘要: Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.
摘要翻译: 提供了电工艺过程控制方法。 在一个实施例中,该方法包括使用目标端点处理在晶片上形成的导电层,检测导电层的穿透以暴露下层的部分,以及响应于检测到的突破来调整目标端点。 在另一个实施例中,相对于通过导电层暴露的下层的量来调整目标端点。
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公开(公告)号:US07709382B2
公开(公告)日:2010-05-04
申请号:US11877233
申请日:2007-10-23
申请人: Antoine P. Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald J. K. Olgado , Liang-Yuh Chen
发明人: Antoine P. Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald J. K. Olgado , Liang-Yuh Chen
IPC分类号: H01L21/44 , H01L21/302 , H01L21/461
CPC分类号: B23H5/08 , B24B37/042 , C25D17/10 , C25F7/00
摘要: Embodiments of the present invention provide methods of electroprocessing a substrate. One embodiment of the present invention provides a method comprises pressing a substrate against a polishing pad with a force less than about two pounds per square inch, the substrate contacting a first electrode of the polishing pad, applying an electrical bias to the substrate with the first electrode relative to a second electrode of the polishing pad, wherein the second electrode is disposed below the second electrode, and biasing a third electrode disposed in the polishing pad radially outward of the second electrode.
摘要翻译: 本发明的实施方案提供了对基底进行电处理的方法。 本发明的一个实施方案提供了一种方法,包括以小于约2磅/平方英寸的力将衬底压靠抛光垫,衬底与抛光垫的第一电极接触,将第一电极施加电偏压至衬底 电极,其中所述第二电极设置在所述第二电极下方,并且偏置设置在所述抛光垫中的第三电极,所述第三电极位于所述第二电极的径向外侧。
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6.
公开(公告)号:US07278911B2
公开(公告)日:2007-10-09
申请号:US11215254
申请日:2005-08-30
申请人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
摘要翻译: 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中,抛光制品包括具有抛光表面的环形上层,以及耦合到上层并与其形成可更换组件的导电层。
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公开(公告)号:US07655565B2
公开(公告)日:2010-02-02
申请号:US11043570
申请日:2005-01-26
申请人: Antoine P. Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald J. K. Olgado , Liang-Yuh Chen
发明人: Antoine P. Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald J. K. Olgado , Liang-Yuh Chen
IPC分类号: H01L21/44 , H01L21/302 , H01L21/461
CPC分类号: B23H5/08 , B24B37/042 , C25D17/10 , C25F7/00
摘要: A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied tot he first electrode.
摘要翻译: 提供了一种用于电子处理衬底的方法和装置。 在一个实施例中,一种用于对衬底进行电处理的方法包括以下步骤:偏置第一电极以在电极和衬底之间建立第一电处理区,并且以与其施加的偏压相反的极性偏置衬底径向外侧的第二电极 第一电极。
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公开(公告)号:US07628905B2
公开(公告)日:2009-12-08
申请号:US11475583
申请日:2006-06-27
申请人: Antoine P. Manens , Alain Duboust , Siew S. Neo , Liang-Yuh Chen
发明人: Antoine P. Manens , Alain Duboust , Siew S. Neo , Liang-Yuh Chen
IPC分类号: B23H3/02
CPC分类号: B24B49/04 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/16 , C25F3/02 , C25F7/00 , G05B2219/45232 , G05B2219/49085 , H04N1/00
摘要: Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.
摘要翻译: 电工艺过程控制的方法和装置。 该方法包括通过施加两个或更多个偏压来电晶体处理,并且分别确定作为每个偏压的结果去除的电荷量。 在一个实施例中,当针对偏置移除的电荷量基本上等于针对偏置计算的相应目标电荷时,针对每个偏置确定端点。
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9.
公开(公告)号:US07422516B2
公开(公告)日:2008-09-09
申请号:US11868829
申请日:2007-10-08
申请人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
摘要翻译: 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中,抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层,以及夹在环形上层和环形下层之间的环形子垫,其与之形成可更换组件。
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公开(公告)号:US07303462B2
公开(公告)日:2007-12-04
申请号:US11087878
申请日:2005-03-22
申请人: Alain Duboust , Antoine P. Manens , Liang-Yuh Chen
发明人: Alain Duboust , Antoine P. Manens , Liang-Yuh Chen
CPC分类号: B24B37/042 , B23H5/08 , B24B37/046
摘要: A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electrochemical mechanical processing (Ecmp) of a substrate face. In one embodiment, a power source applies a bias between the substrate and at least two electrodes. The electrodes form a first electrode zone proximate the substrate edge at a sufficient potential to electro polish the substrate edge, thereby removing the conductive layer from the substrate edge. A second electrode zone with a lower potential than the first electrode zone is aligned proximate the substrate face during processing to enable Ecmp of the substrate face.
摘要翻译: 公开了一种用于使用构造成电抛光衬底边缘的电极沿着衬底的边缘去除沉积的导电层的方法和装置。 基板边缘的电抛光可以在基板表面的电化学机械处理(Ecmp)期间同时发生。 在一个实施例中,电源在衬底和至少两个电极之间施加偏压。 电极以足够的电位形成靠近衬底边缘的第一电极区域,以电抛光衬底边缘,从而从衬底边缘去除导电层。 具有比第一电极区域更低的电位的第二电极区在处理期间靠近衬底面对齐以使得衬底面的Ecmp。
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