公开(公告)号：US20050025434A1

公开(公告)日：2005-02-03

申请号：US10631933

申请日：2003-07-31

申请人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

发明人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

IPC分类号： G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

摘要翻译： 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

公开(公告)号：US20050156310A1

公开(公告)日：2005-07-21

申请号：US10757206

申请日：2004-01-14

申请人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

发明人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： H01L31/0232

CPC分类号： G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

摘要： An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

摘要翻译： 一种用于电子系统的光电组件包括具有第一表面和相对的第二表面的透明衬底，该透明衬底是导热的并且在表面上被金属化。 支持电子芯片组被配置用于提供多路复用，解复用，编码，解码和光电转换器驱动和接收功能中的至少一个并且被结合到透明基板的第二表面。 具有第一表面和相对的第二表面的第一基板经由金属化的第二表面和其间的支撑芯片与透明基板连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持电子芯片组进行信号通信; 并且限定有具有与光电换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面，其中来自支撑电子芯片组的电信号通过金属化的 所述透明基板的第二表面，并且其中所述支撑电子芯片组和所述光电转换器共享用于冷却的公共热路径。

公开(公告)号：US20060182397A1

公开(公告)日：2006-08-17

申请号：US11279276

申请日：2006-04-11

申请人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

发明人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： G02B6/36

CPC分类号： G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

摘要： An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

摘要翻译： 用于电子系统的光电组件包括具有第一表面和相对的第二表面的导热金属化透明基板。 支撑芯片组结合到透明基板的第二表面。 第一衬底经由金属化的第二表面和其间的支撑芯片与透明衬底连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持芯片组进行信号通信，并且具有与换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面。 支撑芯片组和传感器共享一个共同的冷却路径。

公开(公告)号：US20050110160A1

公开(公告)日：2005-05-26

申请号：US10721984

申请日：2003-11-25

申请人： Mukta Faroog ,  John Knickerbocker ,  Frank Pompeo ,  Subhash Shinde

发明人： Mukta Faroog ,  John Knickerbocker ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498 ,  H01L21/44 ,  H01L23/48

CPC分类号： H01L23/562 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/16195

摘要： Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

摘要翻译： 在本发明中，半导体芯片通过插入件结构与基板（例如有机，陶瓷等）电连接。 插入器结构包括弹性体柔性材料，其包括具有预定形状的通过连接的冶金。 在典型的实施例中，冶金通孔连接将半导体芯片的凸起下金属化电连接到衬底的顶表面金属化。 通过利用根据本发明的插入器结构，可以减轻与先前的半导体模块设计相关的问题。

公开(公告)号：US20070252288A1

公开(公告)日：2007-11-01

申请号：US11772901

申请日：2007-07-03

申请人： MUKTA FAROOQ ,  John Knickerbocker ,  Frank Pompeo ,  Subhash Shinde

发明人： MUKTA FAROOQ ,  John Knickerbocker ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/562 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/16195

摘要： Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

摘要翻译： 在本发明中，半导体芯片通过插入件结构与基板（例如有机，陶瓷等）电连接。 插入器结构包括弹性体柔性材料，其包括具有预定形状的通过连接的冶金。 在典型的实施例中，冶金通孔连接将半导体芯片的凸起下金属化电连接到衬底的顶表面金属化。 通过利用根据本发明的插入器结构，可以减轻与先前的半导体模块设计相关的问题。

公开(公告)号：US20060104031A1

公开(公告)日：2006-05-18

申请号：US10904555

申请日：2004-11-16

申请人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

发明人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

摘要翻译： 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

公开(公告)号：US20060060636A1

公开(公告)日：2006-03-23

申请号：US10711501

申请日：2004-09-22

申请人： Glenn Daves ,  David Edwards ,  Mukta Farooq ,  Frank Pompeo

发明人： Glenn Daves ,  David Edwards ,  Mukta Farooq ,  Frank Pompeo

IPC分类号： B23K31/02

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

摘要翻译： 一种用于组装的方法，并且所得到的电子模块包括使用第一焊料互连阵列将芯片附接到衬底，并且使用第二焊料互连阵列将衬底附接到衬底，第二焊料互连阵列可以是单熔体或双 - 熔融焊料阵列。 第二焊料互连阵列完全位于限定在板和衬底之间的空间内。 在该空间内设有抗蠕变结构，用于维持限定的空间并优化第二焊料互连阵列的完整性。 抗蠕变结构可以包括底部填充材料，球，支架，框架，套环或其组合。 其中抗蠕变结构是底部填充材料，在将基板完全用底部填充材料完全封装第二互连阵列之前，或者在具有底部填充材料的不连续位置部分地封装第二焊料互连阵列之前，衬底附着到板上是至关重要的。

公开(公告)号：US20060231633A1

公开(公告)日：2006-10-19

申请号：US10907761

申请日：2005-04-14

申请人： Mukta Farooq ,  Benjamin Fasano ,  Jason Frankel ,  Harvey Hamel ,  Suresh Kadakia ,  David Long ,  Frank Pompeo ,  Sudipta Ray

发明人： Mukta Farooq ,  Benjamin Fasano ,  Jason Frankel ,  Harvey Hamel ,  Suresh Kadakia ,  David Long ,  Frank Pompeo ,  Sudipta Ray

IPC分类号： G06K19/06

CPC分类号： G06K19/07381 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/576 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09263 ,  H05K2201/10151

摘要： A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

摘要翻译： 防干扰集成电路（IC）模块包括陶瓷芯片载体，附接到芯片载体的一个或多个集成电路芯片，以及附接到芯片载体的覆盖一个或多个集成电路芯片的盖结构。 在芯片载体和盖结构中形成导电栅格结构，该导电结构具有沿x方向，y方向和z方向设置的多条曲折线。 导电栅格结构被配置为检测穿透IC模块的尝试。

公开(公告)号：US20080000988A1

公开(公告)日：2008-01-03

申请号：US11768312

申请日：2007-06-26

申请人： Mukta Farooq ,  Benjamin Fasano ,  Jason Frankel ,  Harvey Hamel ,  Suresh Kadakia ,  David Long ,  Frank Pompeo ,  Sudipta Ray

发明人： Mukta Farooq ,  Benjamin Fasano ,  Jason Frankel ,  Harvey Hamel ,  Suresh Kadakia ,  David Long ,  Frank Pompeo ,  Sudipta Ray

IPC分类号： G06K19/06

CPC分类号： G06K19/07381 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/576 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09263 ,  H05K2201/10151

摘要： A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

摘要翻译： 防干扰集成电路（IC）模块包括陶瓷芯片载体，附接到芯片载体的一个或多个集成电路芯片，以及附接到芯片载体的覆盖一个或多个集成电路芯片的盖结构。 在芯片载体和盖结构中形成导电栅格结构，该导电结构具有沿x方向，y方向和z方向设置的多条曲折线。 导电栅格结构被配置为检测穿透IC模块的尝试。

公开(公告)号：US20050071993A1

公开(公告)日：2005-04-07

申请号：US10680622

申请日：2003-10-07

申请人： Mukta Farooq ,  Ray Jackson ,  David Linnell ,  Frank Pompeo

发明人： Mukta Farooq ,  Ray Jackson ,  David Linnell ,  Frank Pompeo

IPC分类号： B23Q15/00 ,  H01L21/00 ,  H01L21/60 ,  H05K13/04

CPC分类号： H01L21/67092 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K13/0486 ,  Y10T29/49144 ,  Y10T29/49755 ,  Y10T29/49757 ,  Y10T29/53091 ,  Y10T29/53261 ,  Y10T29/53274 ,  Y10T29/53404 ,  H01L2924/00

摘要： Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

摘要翻译： 公开了一种用于分离例如卡和基板之间的互连的装置。 该装置包括一个或多个旋转偏置（例如，弹簧加载等）部分圆形结构（例如，叶片，刮板，犁等）和连接到部分圆形结构的一个或多个温度敏感的释放。 当由温度敏感的释放释放时，部分圆形结构被定位成旋转和分离互连。 本发明还可以包括定位成从由部分圆形结构分开的互连件接收焊料的焊料储存器。