公开(公告)号：US20240397670A1

公开(公告)日：2024-11-28

申请号：US18233047

申请日：2023-08-11

Applicant: ALPHA NETWORKS INC.

Inventor： FU-HUNG HSU

IPC: H05K7/20 ,  H01Q1/02

Abstract: An electronic device includes a heat dissipation structure including a first heat dissipation member and a second heat dissipation member. The first heat dissipation member is disposed on a circuit board and is made of a thermally conductive material. The second heat dissipation member is disposed close to an antenna. A projection of the second heat dissipation member on an output surface of the antenna at least covers a portion of the output surface of the antenna. The second heat dissipation member is in contact with the first heat dissipation member. The second heat dissipation member is made of a plastic material mixed with a plurality of ceramic particles.

公开(公告)号：US20220418084A1

公开(公告)日：2022-12-29

申请号：US17680341

申请日：2022-02-25

Applicant: Alpha Networks Inc.

Inventor： FU-HUNG HSU ,  HSIN-HONG CHEN

IPC: H05K1/02

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.