公开(公告)号：US20240039162A1

公开(公告)日：2024-02-01

申请号：US18072418

申请日：2022-11-30

Applicant: ALPHA NETWORKS INC.

Inventor： YI-JU LEE ,  SHIAO-FAN CHEN

IPC: H01Q9/04 ,  H01P3/08

CPC classification number: H01Q9/0457 ,  H01P3/08

Abstract: A microstrip antenna includes a substrate, a feedline, an impedance matching structure, and a patch radiator, wherein the substrate has a surface. The feedline is disposed on the surface and extends along a first axial direction. The impedance matching structure is disposed on the surface and has a first end and a second end in the first axial direction, wherein the first end is connected to the feedline. The impedance matching structure has a stepped impedance change. The patch radiator is disposed on the surface, wherein the patch radiator and the second end of the impedance matching structure are adjacent and spaced by a distance in the first axial direction, and the second end of the impedance matching structure is coupled with the patch radiator through the distance. Therefore, a bandwidth of the microstrip antenna could be increased.

公开(公告)号：US20250079678A1

公开(公告)日：2025-03-06

申请号：US18660257

申请日：2024-05-10

Applicant: Alpha Networks Inc.

Inventor： YI-JU LEE ,  DING-BING LIN ,  YI-HAN WU

IPC: H01P3/12

Abstract: A substrate integrated waveguide having multiple substrate comprises a first substrate and a second substrate stacked with the first substrate, wherein metal layers are formed on opposite sides of the first substrate and opposite sides of the second substrate, a plurality of metal holes are formed between two metal layers of the same substrate to limit transmission paths of electromagnetic waves transmitted in the substrate, and areas having no metal therein are formed between the first and second substrates so that the electromagnetic waves could be transmitted between the first and second substrates thereby.