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公开(公告)号:US09778687B1
公开(公告)日:2017-10-03
申请号:US14733799
申请日:2015-06-08
Applicant: Amazon Technologies, Inc.
Inventor: Vigneswaran Rajagopalan , David Eric Peters , Conan Zhang
CPC classification number: G06F1/1626 , B29C44/04 , B29C44/1271 , B29K2075/00 , B29K2995/0069 , B29L2031/3481 , G06F1/1635 , G06F3/0412
Abstract: The disclosure describes methods of fabricating a single-piece housing for an electronic device using an injection molding process. Illustrative fabrication processes describe variations of positioning internal components of an electronic device into a mold enclosure and injecting a foam material to produce a single-piece housing that surrounds the internal components. The single-piece housing may be fabricated to provide the electronic device with at least some buoyancy, as well a means to expel thermal radiation emanating from internal components. Further, the fabricated single-piece housing provides enough structural rigidity to protect internal components of the electronic device from damage, while retaining some malleability to flex without damage when an external pressure is applied.
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公开(公告)号:US09746894B1
公开(公告)日:2017-08-29
申请号:US14554786
申请日:2014-11-26
Applicant: Amazon Technologies, Inc.
Inventor: Vigneswaran Rajagopalan
Abstract: Systems, devices, methods, computer-readable media, techniques, and methodologies are disclosed for increasing efficiency in power management for user devices. In some embodiments, a system voltage and battery voltage of a user device may be monitored and stored. The system voltage and battery voltage may be analyzed, and a system minimum voltage threshold for a user device may be modified based on the analysis of the measurements.
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