公开(公告)号：US11372506B1

公开(公告)日：2022-06-28

申请号：US17103684

申请日：2020-11-24

Applicant: Amazon Technologies, Inc.

Inventor： Fubin Song ,  Chaoran Yang ,  Kun Tang ,  Xiaoman Li ,  Weitian Liu ,  Zhifan Gong

IPC: G06F3/044 ,  G06F3/041

Abstract: Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.