公开(公告)号：US08279577B2

公开(公告)日：2012-10-02

申请号：US12849012

申请日：2010-08-02

申请人： Andrew Nguyen ,  Wing Lau Cheng ,  Hiroji Hanawa ,  Semyon Kats ,  Kartik Ramaswamy ,  Yan Ye ,  Kwok Manus Wong ,  Daniel J. Hoffman ,  Tetsuya Ishikawa ,  Brian C. Lue

发明人： Andrew Nguyen ,  Wing Lau Cheng ,  Hiroji Hanawa ,  Semyon Kats ,  Kartik Ramaswamy ,  Yan Ye ,  Kwok Manus Wong ,  Daniel J. Hoffman ,  Tetsuya Ishikawa ,  Brian C. Lue

IPC分类号： H01T23/00

CPC分类号： C23C14/564 ,  C23C16/4404 ,  H01J37/16 ,  H01J37/32504 ,  H01J37/32862 ,  H01J37/32871 ,  H01J2237/022 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T428/24 ,  Y10T428/31678

摘要： A support for a substrate processing chamber comprises a chuck having a substrate receiving surface, and a base comprising an upper wall comprising a recessed trench having (i) an attachment face at a first depth, and (ii) a fluid channel at a second depth. A lower wall is seated in the recessed trench and attached to the attachment face of the upper wall, to close the fluid channel. A fluid inlet is provided to supply a heat transfer fluid to the fluid channel and a fluid outlet provided to discharge the heat transfer fluid from the fluid channel.

摘要翻译： 用于衬底处理室的支撑件包括具有衬底接收表面的卡盘，以及包括上壁的基座，该上壁包括凹槽，所述凹槽具有（i）第一深度处的附接面，以及（ii）第二深度处的流体通道 。 下壁位于凹槽中并附着到上壁的附接面，以封闭流体通道。 提供流体入口以将传热流体供应到流体通道和设置用于从流体通道排出传热流体的流体出口。

公开(公告)号：US07768765B2

公开(公告)日：2010-08-03

申请号：US11683994

申请日：2007-03-08

申请人： Andrew Nguyen ,  Wing Lau Cheng ,  Hiroji Hanawa ,  Semyon L. Kats ,  Kartik Ramaswamy ,  Yan Ye ,  Kwok Manus Wong ,  Daniel J. Hoffman ,  Tetsuya Ishikawa ,  Brian C. Lue

发明人： Andrew Nguyen ,  Wing Lau Cheng ,  Hiroji Hanawa ,  Semyon L. Kats ,  Kartik Ramaswamy ,  Yan Ye ,  Kwok Manus Wong ,  Daniel J. Hoffman ,  Tetsuya Ishikawa ,  Brian C. Lue

IPC分类号： H01T23/00

CPC分类号： H01L21/67109

摘要： A support for a substrate processing chamber comprises a fluid circulating reservoir comprising a channel having serpentine convolutions. A fluid inlet supplies a heat transfer fluid to the fluid circulating reservoir and a fluid outlet discharges the heat transfer fluid. In one version, the channel is doubled over to turn back upon itself.

摘要翻译： 用于衬底处理室的支撑件包括流体循环容器，其包括具有蛇形卷积的通道。 流体入口将传热流体供应到流体循环储存器，并且流体出口排出传热流体。 在一个版本中，频道翻倍翻转自己。

公开(公告)号：US07221553B2

公开(公告)日：2007-05-22

申请号：US10421473

申请日：2003-04-22

申请人： Andrew Nguyen ,  Wing Lau Cheng ,  Hiroji Hanawa ,  Semyon L. Kats ,  Kartik Ramaswamy ,  Yan Ye ,  Kwok Manus Wong ,  Daniel J. Hoffman ,  Tetsuya Ishikawa ,  Brian C. Lue

发明人： Andrew Nguyen ,  Wing Lau Cheng ,  Hiroji Hanawa ,  Semyon L. Kats ,  Kartik Ramaswamy ,  Yan Ye ,  Kwok Manus Wong ,  Daniel J. Hoffman ,  Tetsuya Ishikawa ,  Brian C. Lue

IPC分类号： H05F3/00

CPC分类号： H01L21/67109

摘要： A support for a substrate processing chamber has upper and lower walls that are joined by a peripheral sidewall to define a reservoir. A fluid inlet supplies a heat transfer fluid to the reservoir. In one version, a plurality of protrusions extends into the reservoir to perturb the flow of the heat transfer fluid through the reservoir. In another version, the reservoir is an elongated channel having one or more of (i) serpentine convolutions, (ii) integral fins extending into the channel, (iii) a roughened internal surface, or (iv) a changing cross-section. A fluid outlet discharges the heat transfer fluid from the reservoir.

摘要翻译： 用于衬底处理室的支撑件具有通过周边侧壁连接以限定储存器的上壁和下壁。 流体入口将传热流体供应到储存器。 在一个版本中，多个突起延伸到储存器中以扰乱通过储存器的传热流体的流动。 在另一个版本中，储存器是具有（i）蛇形循环中的一个或多个的细长通道，（ii）延伸到通道中的整体翅片，（iii）粗糙化的内表面，或（iv）变化的横截面。 流体出口从储存器排出传热流体。

公开(公告)号：US08292697B2

公开(公告)日：2012-10-23

申请号：US13403839

申请日：2012-02-23

申请人： Wing Lau Cheng ,  Helen Cheng, legal representative ,  Arnold Kholodenko

发明人： Wing Lau Cheng ,  Arnold Kholodenko

IPC分类号： B24B1/00

CPC分类号： B32B5/26 ,  B32B5/28 ,  B32B27/04 ,  H01L21/67051 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/68764 ,  Y10S269/90 ,  Y10S269/901 ,  Y10T428/237 ,  Y10T428/24995 ,  Y10T428/31515

摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. A method of manufacturing the carrier further described. The method includes forming a composite frame having a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom are each formed from a polymer material. The method further includes forming an opening sized for receiving a substrate and providing a plurality of support pins extending into the opening for supporting the substrate within the opening. The opening is formed slightly larger than the substrate such that a gap exists between the substrate and the opening.

摘要翻译： 描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。 进一步描述制造载体的方法。 该方法包括在顶片和芯之间形成具有碳纤维芯，顶片，底片，芳族聚酰胺织物层的复合框架和在底片和芯之间的第二层芳族聚酰胺织物。 顶片和底部均由聚合物材料形成。 该方法还包括形成开口，该开口的尺寸设置成用于接收基底并提供延伸到开口中的多个支撑销，以支撑开口内的基底。 该开口形成为稍微大于基板，使得在基板和开口之间存在间隙。

公开(公告)号：US08146902B2

公开(公告)日：2012-04-03

申请号：US11743516

申请日：2007-05-02

申请人： Wing Lau Cheng ,  Helen Cheng, legal representative ,  Arnold Kholodenko

发明人： Wing Lau Cheng ,  Arnold Kholodenko

IPC分类号： B23Q3/00

CPC分类号： B32B5/26 ,  B32B5/28 ,  B32B27/04 ,  H01L21/67051 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/68764 ,  Y10S269/90 ,  Y10S269/901 ,  Y10T428/237 ,  Y10T428/24995 ,  Y10T428/31515

摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.

摘要翻译： 描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。 载体包括具有开口尺寸的接收基板的框架和用于在开口内支撑基板的多个支撑销，该开口略大于基板，使得基板和开口之间存在间隙。 框架包括复合芯，顶片，底片，顶片和芯之间的芳族聚酰胺织物层，以及在底片和芯之间的第二层芳族聚酰胺织物。 顶片和底片由聚合物材料形成。 还描述了一种制造方法。

公开(公告)号：US20120168079A1

公开(公告)日：2012-07-05

申请号：US13403839

申请日：2012-02-23

申请人： Wing Lau Cheng ,  Arnold Kholodenko ,  Helen Cheng

发明人： Wing Lau Cheng ,  Arnold Kholodenko ,  Helen Cheng

IPC分类号： B29C70/02 ,  C09J5/00

CPC分类号： B32B5/26 ,  B32B5/28 ,  B32B27/04 ,  H01L21/67051 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/68764 ,  Y10S269/90 ,  Y10S269/901 ,  Y10T428/237 ,  Y10T428/24995 ,  Y10T428/31515

摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. A method of manufacturing the carrier further described. The method includes forming a composite frame having a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom are each formed from a polymer material. The method further includes forming an opening sized for receiving a substrate and providing a plurality of support pins extending into the opening for supporting the substrate within the opening. The opening is formed slightly larger than the substrate such that a gap exists between the substrate and the opening.

摘要翻译： 描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。 进一步描述制造载体的方法。 该方法包括在顶片和芯之间形成具有碳纤维芯，顶片，底片，芳族聚酰胺织物层的复合框架和在底片和芯之间的第二层芳族聚酰胺织物。 顶片和底部均由聚合物材料形成。 该方法还包括形成开口，该开口的尺寸设置成用于接收基底并提供延伸到开口中的多个支撑销，以支撑开口内的基底。 该开口形成为稍微大于基板，使得在基板和开口之间存在间隙。

公开(公告)号：US20080152922A1

公开(公告)日：2008-06-26

申请号：US11743516

申请日：2007-05-02

申请人： Wing Lau Cheng ,  Helen Cheng ,  Arnold Kholodenko

发明人： Wing Lau Cheng ,  Helen Cheng ,  Arnold Kholodenko

IPC分类号： B32B27/38

CPC分类号： B32B5/26 ,  B32B5/28 ,  B32B27/04 ,  H01L21/67051 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/68764 ,  Y10S269/90 ,  Y10S269/901 ,  Y10T428/237 ,  Y10T428/24995 ,  Y10T428/31515

摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.

摘要翻译： 描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。 载体包括具有开口尺寸的接收基板的框架和用于在开口内支撑基板的多个支撑销，该开口略大于基板，使得基板和开口之间存在间隙。 框架包括复合芯，顶片，底片，顶片和芯之间的芳族聚酰胺织物层，以及在底片和芯之间的第二层芳族聚酰胺织物。 顶片和底片由聚合物材料形成。 还描述了一种制造方法。