公开(公告)号：US20250071888A1

公开(公告)日：2025-02-27

申请号：US18781453

申请日：2024-07-23

Applicant: Apple Inc.

Inventor： Shawn X. ARNOLD ,  Zhongqing GONG ,  Anping GUO

IPC: H05K1/02 ,  H05K1/11

Abstract: The present disclosure describes a structure with a substrate, a damping structure, and a capacitor structure. The damping structure is disposed over the substrate and includes a rigid material layer and a damping material layer disposed on the rigid material layer. The damping material layer includes a damping material with a tensile strength of about 20 MPa, a Young's modulus of about 0.5 GPa, and an elongation of about 10%. The capacitor structure is disposed over the damping structure, in which the damping structure mitigates (or eliminates) a transfer of piezoelectric and electrostrictive vibrations generated by the capacitor structure to the substrate.

公开(公告)号：US20190012884A1

公开(公告)日：2019-01-10

申请号：US15645444

申请日：2017-07-10

Applicant: Apple Inc.

Inventor： Yanchu XU ,  Zhong-Qing GONG ,  Anping GUO ,  Alex M. LEE ,  Junyi YANG

IPC: G08B6/00 ,  G06F3/01 ,  H05K5/02 ,  B06B1/04

Abstract: A haptic actuator may include a housing, at least one coil carried by the housing, and a field member having opposing first and second sides. The haptic actuator may also include a respective flexure bearing mounting each of the first and second sides of the field member to be reciprocally movable within the housing responsive to the at least one coil. At least one of the flexure bearings may include an arm and a damper body attached thereto.