公开(公告)号：US20200064952A1

公开(公告)日：2020-02-27

申请号：US16549990

申请日：2019-08-23

Applicant: Apple Inc.

Inventor： Pavan O. Gupta ,  Andrew W. Joyce ,  Benedict Drevniok ,  Mo Li ,  David S. Graff ,  Albert Lin ,  Julian K. Shutzberg ,  Hojjat Seyed Mousavi

IPC: G06F3/044 ,  H04M1/02 ,  G06F3/041 ,  G01L1/14 ,  G01L19/00 ,  G01L9/12

Abstract: A device includes a housing defining part of an interior volume and an opening to the interior volume; a cover mounted to the housing to cover the opening and further define the interior volume; a display mounted within the interior volume and viewable through the cover; and a system in package (SiP) mounted within the interior volume. The SiP includes a self-capacitance sense pad adjacent a first surface of the SiP; a set of solder structures attached to a second surface of the SiP, the second surface opposite the first surface; and an IC coupled to the self-capacitance sense pad and configured to output, at one or more solder structures in the set of solder structures, a digital value related to a measured capacitance of the self-capacitance sense pad. The SiP is mounted within the interior volume with the first surface positioned closer to the cover than the second surface.