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公开(公告)号:US20190079452A1
公开(公告)日:2019-03-14
申请号:US15866396
申请日:2018-01-09
Applicant: Apple Inc.
Inventor: Daniel J. HIEMSTRA , Colin M. ELY
Abstract: A watch can include one or more input components, such as a crown for receiving input from a user. The crown can be an assembly of multiple parts, for example, to provide aesthetic, structural, and/or functional attributes. The parts of the crown can be assembled in a manner that resists separation during use and when subject to environmental influences. For example, the assembled parts of a crown can be resistant to separation while a user wearing the watch is swimming, bathing, or sweating. The assembly can be secured by both mechanical mechanisms and chemical mechanisms.
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公开(公告)号:US20220100151A1
公开(公告)日:2022-03-31
申请号:US17033542
申请日:2020-09-25
Applicant: Apple Inc.
Inventor: Sameer PANDYA , Daniel J. HIEMSTRA , Zaki MOUSTAFA
Abstract: Wearable electronic devices, such as watches, can provide a seal member to form a fluid barrier between an inner chamber therein and outer chambers, as well as an external environment. Components within the sealed inner chamber can be protected from elements from the external environment (e.g., water ingress, etc.). The components outside of the inner chamber can include sensor modules and the like. Such components can be operatively connected to components within the inner chamber, for example, by a flex circuit that extends across the seal member. The component can interact with a watchband when coupled to a watch housing of the watch.
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公开(公告)号:US20230393635A1
公开(公告)日:2023-12-07
申请号:US17833784
申请日:2022-06-06
Applicant: Apple Inc.
Inventor: Daniel J. HIEMSTRA , Christopher D. GUICHET
CPC classification number: G06F1/1683 , G06F1/163 , G06F1/1698 , G06F1/189
Abstract: A modular light assembly is designed for integration with wearable devices. For example, the modular light assembly can connect with a wearable device, such as a smartwatch, including both a device housing and a band of the wearable device. Additionally, the modular light assembly can receive communication from the wearable device through various means, including inductive energy transfer. As a result, the modular light assembly can receive communication from the wearable device to activate (turn on) or deactivate (turn off) one or more light sources of the modular light assembly. Additionally, or alternatively, the modular light assembly device may include a button coupled to a switch that can activate or deactivate the light source(s).
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公开(公告)号:US20230351797A1
公开(公告)日:2023-11-02
申请号:US18331867
申请日:2023-06-08
Applicant: Apple Inc.
Inventor: Daniel J. HIEMSTRA , George Ho Yin MAK , Ehsan KHAJEH , Hoishun LI
CPC classification number: G06V40/1306 , G06F3/0412 , G06F3/0436 , G10K11/02
Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
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公开(公告)号:US20220366719A1
公开(公告)日:2022-11-17
申请号:US17660308
申请日:2022-04-22
Applicant: Apple Inc.
Inventor: Daniel J. HIEMSTRA , George Ho Yin MAK , Ehsan KHAJEH , Camille L. EVERHART
Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
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