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公开(公告)号：US20250098354A1
公开(公告)日：2025-03-20
申请号：US18467041
申请日：2023-09-14
Applicant: Apple Inc.
Inventor： Henry M. DAGHIGHIAN , Patrick Zilaro , Joel Weiss
IPC: H01L27/146
Abstract: The present disclosure describes an integrated circuit device that includes a ceramic-based substrate, a stack of layers disposed on the ceramic-based substrate, and electronic elements. The stack of layers includes an insulation layer and a conductive layer having conductive traces. The electronic elements are electrically connected to the conductive layer. The conductive layer is configured to route electrical signals to the electronic elements.
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