公开(公告)号：US10665578B2

公开(公告)日：2020-05-26

申请号：US15908478

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Edzer Huitema ,  Vaibhav Patel ,  Tore Nauta ,  Xia Li ,  Hsin-Hua Hu

IPC: H01L21/78 ,  H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L21/56 ,  H01L21/683 ,  H01L25/075

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

公开(公告)号：US20190096864A1

公开(公告)日：2019-03-28

申请号：US15908478

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Edzer Huitema ,  Vaibhav Patel ,  Tore Nauta ,  Xia Li ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L21/56

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.