公开(公告)号：US20220099426A1

公开(公告)日：2022-03-31

申请号：US17530538

申请日：2021-11-19

Applicant: Applied Materials, Inc.

Inventor： Tomoharu MATSUSHITA ,  Aravind KAMATH ,  Jallepally RAVI ,  Cheng-Hsiung TSAI ,  Hiroyuki TAKAHAMA

IPC: G01B5/004 ,  H01L21/683 ,  H01L21/68

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.