公开(公告)号：US20160167311A1

公开(公告)日：2016-06-16

申请号：US14968283

申请日：2015-12-14

Applicant: Autodesk, Inc.

Inventor： Ryan Michael Schmidt ,  Daniel Matthew Taub ,  Baoxuan Xu ,  Karl Willis

IPC: B29C67/00 ,  G05B19/4099 ,  G06F17/50

CPC classification number: G05B19/4099 ,  B33Y50/00 ,  G05B2219/35134 ,  G05B2219/49007 ,  G06F17/5068 ,  Y02P90/265

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for combining electronic circuitry with mechanical structures using a design tool to build hybrid electro-mechanical three-dimensional circuits for 3D printed devices. In some implementations, the design tool facilitates creation and placement of components and traces, and print preparation for additive manufacturing systems.

Abstract translation: 方法，系统和装置，包括中等编码的计算机程序产品，用于使用设计工具将电子电路与机械结构组合以构建用于3D印刷装置的混合电 - 机械三维电路。 在一些实施方案中，设计工具有助于组件和迹线的创建和放置，以及用于添加剂制造系统的打印准备。

公开(公告)号：US10311381B2

公开(公告)日：2019-06-04

申请号：US14968283

申请日：2015-12-14

Applicant: Autodesk, Inc.

Inventor： Ryan Michael Schmidt ,  Daniel Matthew Taub ,  Baoxuan Xu ,  Karl Willis

IPC: G06Q10/00 ,  G05B19/4099 ,  H05K1/18 ,  G06F17/50 ,  B33Y50/00

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for combining electronic circuitry with mechanical structures using a design tool to build hybrid electro-mechanical three-dimensional circuits for 3D printed devices. In some implementations, the design tool facilitates creation and placement of components and traces, and print preparation for additive manufacturing systems.