公开(公告)号：US09502269B2

公开(公告)日：2016-11-22

申请号：US14676503

申请日：2015-04-01

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Alan M. Berard ,  John A. Hughes ,  Keith K. Sturcken ,  Timothy Whalen

IPC: H01L21/50 ,  H01L23/36 ,  H01L23/10 ,  H01L23/427

CPC classification number: H01L21/50 ,  H01L23/10 ,  H01L23/36 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: An apparatus for cooling electronic devices to be used in the vacuum of space is described. a window frame is provided as packaging for an electronic device having a substrate and a chip. The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip. The window frame is hermetically sealed to the backside of the chip. The window frame is also welded to a kovar ring located on the backside of the chip to provide a hermetic seal between the window frame and the substrate.

Abstract translation: 描述用于冷却在空间真空中使用的电子装置的装置。 提供了一种用于具有基板和芯片的电子设备的封装的窗框。 窗框包括允许热管与芯片的背面直接接触的开口。 窗框被密封到芯片的背面。 窗框还焊接到位于芯片背面的科瓦环，以在窗框和基板之间提供气密密封。