公开(公告)号：US20240339365A1

公开(公告)日：2024-10-10

申请号：US18297798

申请日：2023-04-10

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Nathaniel P. Wyckoff ,  Jacob R. Mauermann ,  Mark E. Whiting

IPC: H01L21/66 ,  G01R1/067

CPC classification number: H01L22/30 ,  G01R1/067

Abstract: A microelectronic component includes a substrate having at least one electrical pad, a resilient material on the substrate, and a conductive element on or in the resilient material and coupled to the at least one conductive pad. The resilient material may include, for instance, a compressible polymer. The conductive elements configured to be placed in contact with at least one test probe, where the resilient material is configured to be compressed by the at least one electrical probe into a deformed shape and where the resilient material is configured to return from the deformed shape to a non-deformed shape subsequent to a removal of the conductive element from contact with the at least one electrical probe.