VOICE CHIP IMPLEMENTATION METHOD, VOICE CHIP, AND RELATED DEVICE

    公开(公告)号:US20250077469A1

    公开(公告)日:2025-03-06

    申请号:US18025026

    申请日:2022-06-28

    Abstract: The present disclosure provides a method of voice chip implementation, a voice chip, an intelligent voice product, an electronic device, and a storage medium, and relates to the field of artificial intelligence (AI) such as intelligent voice and AI chips. The method may include: constructing a voice chip including a first Digital Signal Processor (DSP) and a second DSP, the first DSP and the second DSP corresponding to a same Digital Signal Processor core Identifier (DSP core IP) and adopting heterogeneous designs; and completing a chip processing function in a corresponding intelligent voice product by using the voice chip, wherein different functions are completed by using the first DSP and the second DSP respectively. By use of the solutions of the present disclosure, implementation costs can be reduced.

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