公开(公告)号：US20230172076A1

公开(公告)日：2023-06-01

申请号：US18095994

申请日：2023-01-11

Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.

Inventor： Hanzhe XI ,  Zhengyi Cui ,  Lijing Jin

IPC: H10N60/12 ,  G06N10/40 ,  H10N60/80

CPC classification number: H10N60/12 ,  G06N10/40 ,  H10N60/805

Abstract: A quantum chip is provided, includes: a first substrate and a second substrate arranged opposite to each other, wherein a plurality of qubits and a plurality of first controllers are arranged on a surface of the first substrate facing the second substrate, each of the plurality of qubits is coupled with at least one of the plurality of first controllers, and a plurality of control signal transmission parts are arranged on a surface of the second substrate facing the first substrate; and a plurality of connecting pieces, connected between the first substrate and the second substrate, and configured to connect the plurality of first controllers to the plurality of control signal transmission parts in a one-to-one corresponding mode.