公开(公告)号：US20090010010A1

公开(公告)日：2009-01-08

申请号：US12043409

申请日：2008-03-06

申请人： Baoyan CHANG ,  Xianghong Yang ,  Zheng Xu

发明人： Baoyan CHANG ,  Xianghong Yang ,  Zheng Xu

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/89 ,  F21Y2115/10

摘要： The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protecting rubber ring mounted at the obverse of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protecting rubber ring, the heat dissipating substrate being provided with two through holes impenetrating its obverse and inverse, in each of the two through holes separately provided with a pin connecting to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the inverse of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a dielectric. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly.

摘要翻译： 本发明提供一种LED直插式多芯片大功率光源，包括散热基板，安装在散热基板正面的保护橡胶环，固定在散热基板上的LED和保护橡胶 所述散热基板在其两个通孔中分别设置有连接到所述LED的销的一个端部，插入所述通孔中的一端，并且所述散热基板的另一端分别设置有穿过其正面和反向的两个通孔， 该引脚从散热基板的反向引出到散热基板的外部，并且插入通孔中的销的部分通过电介质与散热基板分离。 散热基板由高导热金属制成。 在本发明中，散热基板由高导热性金属制成，导热柱被消除。 与现有技术相比，本发明减少了散热路径，增大了截面面积，消除了高耐热性的中间环节。 本发明增加了单个光源的功率，大大降低了光的衰减，大大提高了使用寿命。