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公开(公告)号:US08155933B2
公开(公告)日:2012-04-10
申请号:US12453873
申请日:2009-05-26
IPC分类号: G06F17/50
摘要: The method of modeling residual stresses during laser cutting utilizes thermal diffusion and stress equations and a discretization numerical method to model temperature variation and residual stresses in a substrate material due to laser cutting therethrough of small-diameter holes.
摘要翻译: 在激光切割期间对残余应力进行建模的方法利用热扩散和应力方程和离散数值方法来模拟由于小直径孔的激光切割而导致的衬底材料中的温度变化和残余应力。