Method of modeling residual stresses during laser cutting
    1.
    发明授权
    Method of modeling residual stresses during laser cutting 有权
    激光切割期间残余应力建模方法

    公开(公告)号:US08155933B2

    公开(公告)日:2012-04-10

    申请号:US12453873

    申请日:2009-05-26

    IPC分类号: G06F17/50

    CPC分类号: B23K26/38 B23K31/12

    摘要: The method of modeling residual stresses during laser cutting utilizes thermal diffusion and stress equations and a discretization numerical method to model temperature variation and residual stresses in a substrate material due to laser cutting therethrough of small-diameter holes.

    摘要翻译: 在激光切割期间对残余应力进行建模的方法利用热扩散和应力方程和离散数值方法来模拟由于小直径孔的激光切割而导致的衬底材料中的温度变化和残余应力。