公开(公告)号：US20160300661A1

公开(公告)日：2016-10-13

申请号：US14753482

申请日：2015-06-29

Applicant: Broadcom Corporation

Inventor： Namhoon Kim ,  Sampath Komarapalayam Karikalan ,  Zhihui Wang ,  Jin Seong Choi ,  Boon Leong Tan ,  Edward Law

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F27/29 ,  H01F2027/2809

Abstract: Inductors are fabricated in core layers according to a predefined semiconductor package manufacturing process rules. The inductors provide an embedded substrate trace inductor solution. The inductors may be part of an on-chip voltage regulator or any other circuit design. The inductors provide a core spiral structure to help increase inductance, particularly using magnetic field coupling between inductors. The core layers provide thicker and heavier conductive segments for the inductors, particularly as compared to inductors fabricated in build-up layers according to the semiconductor package manufacturing process rules.

Abstract translation: 电感器根据预定义的半导体封装制造工艺规则在芯层中制造。 电感器提供嵌入式衬底跟踪电感器解决方案。 电感器可以是片上稳压器或任何其他电路设计的一部分。 电感器提供核心螺旋结构以帮助增加电感，特别是使用电感器之间的磁场耦合。 核心层为电感器提供较厚和较重的导电段，特别是与根据半导体封装制造工艺规则在积层中制造的电感器相比。