公开(公告)号：US20190172775A1

公开(公告)日：2019-06-06

申请号：US16205790

申请日：2018-11-30

Applicant: CANON COMPONENTS, INC.

Inventor： Akihiro SAKATA

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A flexible substrate according to the present invention comprises a first resin layer, a first wiring layer that is arranged on the first resin layer, a second resin layer that is arranged on the first resin layer so as to cover the first wiring layer, and a second wiring layer that is arranged on the second resin layer, wherein the first wiring layer and the second wiring layer are connected to each other with a filled via, and the first wiring layer and the second resin layer are in direct contact with each other. By virtue of this feature, the reliability of a flexible substrate will be improved with a relatively simple configuration.