公开(公告)号：US20240244932A1

公开(公告)日：2024-07-18

申请号：US17779799

申请日：2021-05-19

申请人： BOE Technology Group Co., Ltd. ,  Chengdu BOE Optoelectronics Technology Co., Ltd.

发明人： Yunhao WANG ,  Peng HOU ,  Yongzhan HAN ,  Yuan HE ,  Can HUANG ,  Zhen LI ,  Yulin WANG ,  Jiandong BAO ,  Pengcheng ZHAO ,  Yide DU

IPC分类号： H10K59/80 ,  H10K59/12 ,  H10K59/122 ,  H10K59/126 ,  H10K59/35 ,  H10K59/38

CPC分类号： H10K59/8731 ,  H10K59/1201 ,  H10K59/122 ,  H10K59/126 ,  H10K59/352 ,  H10K59/353 ,  H10K59/38 ,  H10K59/8792

摘要： The present application provides display substrates and their manufacturing methods, and display devices. A display substrate includes a base substrate, an encapsulation layer, a filter layer and optical film layers. The encapsulation layer is located on the base substrate. The filter layer is located in the encapsulation layer. The filter layer includes black matrixes. The black matrixes include black matrix openings. The optical film layers are located on a side of the encapsulation layer away from the base substrate. The optical film layers are configured to transmit part of incident light and absorb part of the incident light. A light transmittance of the optical film layers is larger than that of the black matrixes. The optical film layers include optical film layer openings. Projections of the optical film layer openings on the base substrate are located within projections of the black matrix openings on the base substrate.

公开(公告)号：US20220320465A1

公开(公告)日：2022-10-06

申请号：US17425300

申请日：2021-02-08

申请人： CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Rui HOU ,  Yulin WANG ,  Ming YANG ,  Weilin LAI ,  Yide DU ,  Jiandong BAO

IPC分类号： H01L51/52 ,  H01L51/00 ,  H01L27/32

摘要： A display region includes: a first display region including a first thin film encapsulation structure; a second display region including a second thin film encapsulation structure; and a transition display region including a third thin film encapsulation structure. The first thin film encapsulation structure includes a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer. The second thin film encapsulation structure includes the first organic encapsulation layer, the second inorganic encapsulation layer and a second organic encapsulation layer. The third thin film encapsulation structure includes a first portion and a second portion. The first portion includes the first inorganic encapsulation layer, the first organic encapsulation layer, the second inorganic encapsulation layer and the second organic encapsulation layer. The second portion includes the first inorganic encapsulation layer, the second inorganic encapsulation layer and the second organic encapsulation layer.

公开(公告)号：US20220006053A1

公开(公告)日：2022-01-06

申请号：US17286263

申请日：2020-09-21

申请人： CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Zhen LI ,  Shasha ZHU ,  Yulin WANG ,  Rui HOU ,  Yide DU

IPC分类号： H01L51/52 ,  H01L51/56

摘要： This disclosure provides a packaging structure for a display substrate, a packaging method and a display device. The packaging structure for the display substrate includes a base substrate, a light-emitting device arranged on the base substrate, and a packaging thin film covering the light-emitting device. The packaging thin film includes an inorganic thin film and an organic thin film that are laminated, and the organic thin film is arranged on a surface of the inorganic thin film away from the base substrate. The packaging thin film includes a central region and a peripheral region surrounding the central region, the inorganic thin film located in the central region has surface energy greater than that of the inorganic thin film in the peripheral region, and the organic thin film in the central region has a thickness less than that of the organic thin film in the peripheral region.