公开(公告)号：US09412907B1

公开(公告)日：2016-08-09

申请号：US14690284

申请日：2015-04-17

Applicant: CREE, INC.

Inventor： Thomas Place ,  Bennett Dean Langsdorf

IPC: H01L31/0256 ,  H01L33/38 ,  H01L33/08

CPC classification number: H01L33/382 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The present disclosure provides various embodiments of light emitting chips and packages with improved current spreading structures, such as non-uniform via structures or varied via structures. In some embodiments, these structures may be used to regulate current flow and current crowding in order to improve emitter efficiency and uniformity. Some embodiments of this disclosure may also refer to contact pad placement to improve current flow. In some embodiments of non-uniform via structures, the size of the vias may vary, whereas in other embodiments, the shape or spacing between the vias may vary.

Abstract translation: 本公开提供了具有改进的电流扩散结构（例如不均匀的通孔结构或变化的通孔结构）的发光芯片和封装的各种实施例。 在一些实施例中，这些结构可用于调节电流和电流拥挤，以便提高发射极效率和均匀性。 本公开的一些实施例还可以指接触垫放置以改善电流。 在非均匀通孔结构的一些实施例中，通孔的尺寸可以变化，而在其它实施例中，通孔之间的形状或间隔可以变化。