摘要:
The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35. The locking plate 34 is supported pivotally and slidably, and is provided with a holding claw 51 for engaging the second fitted portion 21 at the distal end thereof. The thin-plate holding container 1 is used for transportation when the lid unit 4 for transportation is attached on the container body 2, and is used for the production line when the lid body 5 for the production line is attached thereon.
摘要:
A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.
摘要:
A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.
摘要:
The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction. The wafer presser is supported by a supporting projection bar formed with its ends thinner than its center portion.
摘要:
The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction. The wafer presser is supported by a supporting projection bar formed with its ends thinner than its center portion.
摘要:
The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction. The wafer presser is supported by a supporting projection bar formed with its ends thinner than its center portion.
摘要:
A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.
摘要:
The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35. The locking plate 34 is supported pivotally and slidably, and is provided with a holding claw 51 for engaging the second fitted portion 21 at the distal end thereof. The thin-plate holding container 1 is used for transportation when the lid unit 4 for transportation is attached on the container body 2, and is used for the production line when the lid body 5 for the production line is attached thereon.
摘要:
The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction. The wafer presser is supported by a supporting projection bar formed with its ends thinner than its center portion.
摘要:
A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.