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公开(公告)号：US20230112848A1
公开(公告)日：2023-04-13
申请号：US18064506
申请日：2022-12-12
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK , Gianlorenzo MASINI
Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
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公开(公告)号：US20240077672A1
公开(公告)日：2024-03-07
申请号：US18506724
申请日：2023-11-10
Applicant: Cisco Technology, Inc.
Inventor： Subal SAHNI , Kamal V. KARIMANAL , Gianlorenzo MASINI , Attila MEKIS , Roman BRUCK
CPC classification number: G02B6/1225 , G02B6/12014 , G02B2006/12061 , G02B2006/12107 , G02B2006/12135
Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
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公开(公告)号：US20220260775A1
公开(公告)日：2022-08-18
申请号：US17249060
申请日：2021-02-18
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK , Thierry J. PINGUET , Attila MEKIS
Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
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公开(公告)号：US20230236348A1
公开(公告)日：2023-07-27
申请号：US17648634
申请日：2022-01-21
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK
CPC classification number: G02B5/3083 , G02B6/4209 , G02F1/0955 , G02B27/28
Abstract: Embodiments herein describe a focal polarization displacer with a birefringent crystal disposed within the focal region of a lens. The birefringent crystal separates optical signals into at least two separate signals based on having different polarization states and an optical axis of the birefringent crystal is set so that focal points of the two separate signals are at an output surface of the polarization displacer where the two separate signals are output from the polarization displacer. This output surface can be a surface of the birefringent crystal or a surface of additional layer coupled to the crystal such as a polarization rotator or dielectric layer.
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公开(公告)号：US20220244459A1
公开(公告)日：2022-08-04
申请号：US17248579
申请日：2021-01-29
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK , Gianlorenzo MASINI
Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
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Patent Agency Ranking
公开(公告)号：US20240369772A1
公开(公告)日：2024-11-07
申请号：US18310433
申请日：2023-05-01
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK , Shawn X. WANG , Attila MEKIS
IPC: G02B6/293
Abstract: Certain embodiments of the present disclosure are directed towards an optical assembly such as a wavelength multiplexers/demultiplexers (MDM). One example optical assembly generally includes: one or more wavelength filters configured to separate a plurality of wavelengths of an optical signal into respective optical signals; and a lens array comprising a first angled facet configured to reflect the optical signal to the one or more wavelength filters, wherein the lens array is configured to receive one or more of the respective optical signals from the one or more wavelength filters and focus the one or more of the respective optical signals before reaching an optical interface for a photonic chip.
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公开(公告)号：US20240094483A1
公开(公告)日：2024-03-21
申请号：US18315118
申请日：2023-05-10
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK
CPC classification number: G02B6/4215 , G02B6/2706 , G02B6/29365 , G02B6/4213 , G02B6/4214
Abstract: Certain embodiments of the present disclosure are directed towards an optical assembly such as a multiplexers/demultiplexers (MDM). One example optical assembly generally includes: a fiber array configured to provide an optical signal with a plurality of wavelengths; optical wavelength filters configured to separate the plurality of wavelengths into respective optical signals; a lens array configured to receive the respective optical signals from the optical wavelength filters and focus the respective optical signals before reaching an optical interface for a photonic chip; and a birefringent crystal disposed between the lens array and the optical interface.
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公开(公告)号：US20230266545A1
公开(公告)日：2023-08-24
申请号：US17652408
申请日：2022-02-24
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK , Attila MEKIS
IPC: G02B6/42
CPC classification number: G02B6/4215 , G02B6/42
Abstract: According to an embodiment, an apparatus includes a first grating and a second grating in a stack with the first grating. The first grating includes a first plurality of scatterers in a first two-dimensional (2D) arrangement. The second grating includes a second plurality of scatterers in a second 2D arrangement. The first grating and the second grating are arranged to redirect a first optical signal and a second optical signal traveling through the stack. The first optical signal enters the stack in a first direction, and the second optical signal enters the stack in a second direction different from the first direction. Each of the second plurality of scatterers is offset from a corresponding scatterer of the first plurality of scatterers in a third direction different from the first and second directions. Other embodiments include a method performed by the apparatus.
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公开(公告)号：US20230244031A1
公开(公告)日：2023-08-03
申请号：US18297373
申请日：2023-04-07
Applicant: Cisco Technology, Inc.
Inventor： Roman BRUCK , Thierry J. PINGUET , Attila MEKIS
Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
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公开(公告)号：US20220128761A1
公开(公告)日：2022-04-28
申请号：US17081852
申请日：2020-10-27
Applicant: Cisco Technology, Inc.
Inventor： Subal SAHNI , Kamal V. KARIMANAL , Gianlorenzo MASINI , Attila MEKIS , Roman BRUCK
Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
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