公开(公告)号：US12142578B2

公开(公告)日：2024-11-12

申请号：US17492836

申请日：2021-10-04

Applicant: Cisco Technology, Inc.

Inventor： Xiaohong Wu ,  Xing Wang ,  Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Joel Goergen

IPC: H01L23/50 ,  H01L23/00 ,  H01L23/053 ,  H01R12/00 ,  H05K1/18 ,  H05K7/10

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.