公开(公告)号：US20220084709A1

公开(公告)日：2022-03-17

申请号：US17406125

申请日：2021-08-19

Applicant: ColdQuanta, Inc.

Inventor： Steven Michael HUGHES

IPC: G21K1/00

Abstract: An ultra-high-vacuum (UHV) cell includes an integrated guide stack (IGS) as part of a boundary between an internal vacuum and an external ambient. The IGS is formed by bonding together plural integrated guide components (IGCs). Each IGC includes (prior to the bonding) electrical and/or electro-magnetic (EM) guides defined within a bulk material such as glass or silicon. The electrical guides can be, for example, conductive paths or vias, while the EM guides can include microwave or other RF guides, optical fibers and/or paths along which an index of refraction has been modified along an desired optical path. EM and electrical connections between IGCs can be formed after the IGCs are bonded together to form the IGS. Use of an IGS as a vacuum boundary can provide substantial functionality for manipulating and interrogating quantum particles; the functionality can include, for example, the ability to regulate fields within the UHV cell.

公开(公告)号：US20210410266A1

公开(公告)日：2021-12-30

申请号：US17340039

申请日：2021-06-06

Applicant: ColdQuanta, Inc.

Inventor： Mark SAFFMAN ,  Thomas William NOEL ,  Steven Michael HUGHES

IPC: H05H3/04 ,  G06N10/00

Abstract: A vacuum cell provides for electric field control within an ultra-high vacuum (UHV) for cold-neutral-atom quantum computing and other quantum applications. Electrode assemblies extend through vacuum cell walls. Prior to cell assembly, contacts are bonded to respective locations on the ambient-facing surfaces of the walls. Trenches are formed in the vacuum-facing surfaces of walls and via holes are formed, extending from trenches through the wall and into the contacts. Plating conductive material into the trenches and via holes forms the electrodes and vias. The electrodes are contained by the trenches and do not extend beyond the trenches so as to avoid interfering with the bonding of components to the vacuum-facing surfaces of the walls. The vias extend into the contacts to ensure good electrical contact. An electric-field controller applies electric potentials to the electrodes (via the contacts) to control electric fields within the vacuum.

公开(公告)号：US20230070293A1

公开(公告)日：2023-03-09

申请号：US17752069

申请日：2022-05-24

Applicant: ColdQuanta, Inc.

Inventor： Taek il OH ,  Steven Michael HUGHES

IPC: G02B1/00

Abstract: Metamaterial optics are integrated with vacuum-boundary walls of ultra-high-vacuum (UHV) cells to manipulate light in a manner analogous to various bulk optical elements including lenses, mirrors, beam splitters, polarizers, waveplate, wave guides, frequency modulators, and amplitude modulators. For example, UHV cells can have metasurface lenses formed on interior and/or exterior surfaces on one or more of their vacuum-boundary walls. Each metasurface lens can include a plurality of mesas with the same height and various cross-sectional dimensions. The uses of metasurface lenses allows through-going laser beams to be expanded, collimated or focused without using bulky refractive optics. Each metasurface lens can be formed on a cell wall using photolithographic or other techniques.

公开(公告)号：US20200095121A1

公开(公告)日：2020-03-26

申请号：US16137756

申请日：2018-09-21

Applicant: ColdQuanta, Inc.

Inventor： Steven Michael HUGHES

IPC: B81C3/00

Abstract: Reversible (relatively weak) anodic bonds permit glass and silicon components to be separated without damaging the components so that they can be reused. To this end, chamfered glass with high aluminum content can be used during the original anodic bonding. Anodic bonding is terminated after complete intimate contact is achieved and while the bond is reversible. The high aluminum content impedes further bond strengthening so that the bond does not become non-reversible via contact bonding. The chamfer provides access near the glass-silicon interface for prying the glass off the silicon to effect debonding without damaging the glass or the silicon. Accordingly, the glass, the silicon, or both may be rebounded (rather than being wastefully disposed).