公开(公告)号：US20040040592A1

公开(公告)日：2004-03-04

申请号：US10229609

申请日：2002-08-28

Applicant: Delphi Technologies Inc.

Inventor： Philip K. Schneider

IPC: H01L025/00

CPC classification number: G01K7/021

Abstract: A thermopile structure containing improved heat sinks for thermocouples in the detectors is described. The heat sinks are provided without additional processing. The heat sinks are added by using nulldummy tracesnull to the polysilicon mask. The nulldummy tracesnull act as heat sinks to transfer of thermal energy from the narrow metallic traces used in the thermocouple. The nulldummy tracesnull are not electrically connected to the thermopile, therefore they do not affect the electrical resistance of the thermopile. Also, the nulldummy tracenull does not add significant mass to the thermopile/membrane system; therefore they do not adversely affect the thermal conductance of the system.

Abstract translation: 描述了包含用于检测器中的热电偶的改进的散热器的热电堆结构。 提供散热器而不需要额外的处理。 散热器通过使用“虚拟走线”加到多晶硅掩模上。 “虚拟轨迹”作为热沉从热电偶中使用的窄金属轨迹传递热能。 “虚拟轨迹”不与热电堆电连接，因此它们不影响热电堆的电阻。 此外，“虚拟轨迹”不会对热电堆/膜系统增加显着的质量; 因此它们不会对系统的热传导产生不利影响。