Thermal system with rankine circuit

    公开(公告)号:US11028756B2

    公开(公告)日:2021-06-08

    申请号:US16535531

    申请日:2019-08-08

    Inventor: Julien Rapior

    Abstract: A thermal system includes a Rankine cycle heat recovery device including a Rankine circuit having a first heat exchanger, an expander, a condenser, and a first pump. A cooling device having a cooling circuit that includes a second heat exchanger, a second pump, and a third heat exchanger with a device to be cooled. The thermal system comprises a device for regulating the pressure in the Rankine circuit and includes an enclosure delimiting a space and housing a movable part separating the space into first and second chambers. The first chamber communicates with the Rankine circuit and the second chamber communicates with the cooling circuit.

    THERMAL SYSTEM WITH RANKINE CIRCUIT
    2.
    发明申请

    公开(公告)号:US20200049052A1

    公开(公告)日:2020-02-13

    申请号:US16535531

    申请日:2019-08-08

    Inventor: Julien Rapior

    Abstract: A thermal system includes a Rankine cycle heat recovery device including a Rankine circuit having a first heat exchanger, an expander, a condenser, and a first pump. A cooling device having a cooling circuit that includes a second heat exchanger, a second pump, and a third heat exchanger with a device to be cooled. The thermal system comprises a device for regulating the pressure in the Rankine circuit and includes an enclosure delimiting a space and housing a movable part separating the space into first and second chambers. The first chamber communicates with the Rankine circuit and the second chamber communicates with the cooling circuit.

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