公开(公告)号：US20240190019A1

公开(公告)日：2024-06-13

申请号：US18506935

申请日：2023-11-10

Applicant: FormFactor, Inc.

Inventor： Benedikt Marx ,  Axel Becker

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0616 ,  B25J11/0095

Abstract: Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.