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    WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION
    3.
    发明申请
    WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION 有权
    WAFER CARRIER PURGE装置，包括其中的自动机械处理系统以及在集成电路制造过程中处理波浪载体的方法

    公开(公告)号：US20160155654A1

    公开(公告)日：2016-06-02

    申请号：US15015578

    申请日：2016-02-04

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： William J. Fosnight ,  Stephanie Waite ,  Stephen B. Miner ,  John Robinson

    IPC: H01L21/673 ,  B08B5/02 ,  B08B9/00 ,  H01L21/677

    CPC classification number: H01L21/67389 ,  B08B5/00 ,  B08B5/02 ,  B08B9/00 ,  H01L21/67769 ,  H01L21/67775

    Abstract: A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

    Abstract translation: 提供了晶片载体清除装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。 晶片载体清洗装置包括适于插入载体存放位置的清洗板。 净化板包括气体端口和与气体端口流体连通的气体喷嘴。 气体端口接收气流。 气体喷嘴适于接触晶片载体的入口。 吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。 真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。 净化板是分离的，可从载体存放位置移除。

    Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
    4.
    发明授权
    Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication 有权
    晶片载体清洗装置，包括其的自动机械处理系统以及在集成电路制造期间处理晶片载体的方法

    公开(公告)号：US09257320B2

    公开(公告)日：2016-02-09

    申请号：US13910683

    申请日：2013-06-05

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： William J. Fosnight ,  Stephanie Waite ,  Stephen B. Miner ,  John Robinson

    IPC: H01L21/673 ,  H01L21/677 ,  B08B5/02 ,  B08B5/00 ,  B08B9/00

    CPC classification number: H01L21/67389 ,  B08B5/00 ,  B08B5/02 ,  B08B9/00 ,  H01L21/67769 ,  H01L21/67775

    Abstract: A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

    Abstract translation: 提供了晶片载体清洗装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。 晶片载体清洗装置包括适于插入载体存放位置的清洗板。 净化板包括气体端口和与气体端口流体连通的气体喷嘴。 气体端口接收气流。 气体喷嘴适于接触晶片载体的入口。 吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。 真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。 净化板是分离的，可从载体存放位置移除。

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