公开(公告)号：US20230018827A1

公开(公告)日：2023-01-19

申请号：US17786586

申请日：2020-11-11

Applicant: GOERTEK INC.

Inventor： Jiapeng NIU ,  Zhijun SUN

IPC: H04R1/28 ,  H04R1/02 ,  H04R9/06 ,  H04R9/02

Abstract: Provided are a sound absorbing material encapsulation structure for a sound production device, and a sound production device. The sound absorbing material encapsulation structure comprises: a rigid cavity wall enclosed to form a cavity of the sound absorbing material encapsulation structure, the cavity is configured to accommodate a sound absorbing material, the rigid cavity wall is provided with air permeability holes arranged in an array, the air permeability holes are configured to form a channel for air to flow in and out of the sound absorbing material encapsulation structure, diameters of air permeability holes are smaller than a diameter of sound absorbing material; a bottom plate sealed and connected to one end surface of rigid cavity wall, the bottom plate is configured to support the sound absorbing material; a covering plate provided to cover another end surface of rigid cavity wall and sealed and connected to the rigid cavity wall.