公开(公告)号：US20180152790A1

公开(公告)日：2018-05-31

申请号：US15573727

申请日：2015-12-08

Applicant: GOERTEK INC.

Inventor： Qingbin DONG ,  Jie HE ,  Wuchao WANG

IPC: H04R9/02 ,  H04R9/06 ,  H04R1/02

CPC classification number: H04R9/022 ,  H04R1/021 ,  H04R1/028 ,  H04R9/06 ,  H04R2499/11 ,  H05K7/20

Abstract: It is disclosed a speaker module, including a module housing, a speaker assembly and a heat-dissipating member. The module housing has an inner cavity, the inner cavity includes a front cavity and a rear cavity spaced apart from the front cavity, and the front cavity is communicated with an external space. The speaker assembly is mounted in the inner cavity, the speaker assembly includes a vibration diaphragm spacing the front cavity and the rear cavity apart. The heat-dissipating member has a heat-conducting section and a heat-dissipating section, the heat-conducting section is in contact with the speaker assembly, the heat-dissipating section stretches into the front cavity. The vibration of the vibration diaphragm allows air in the front cavity to flow to increase the heat-dissipating rate of the heat-dissipating section. The heat-dissipating section may have a heat-dissipating structure for increasing a heat-dissipating area, and the heat-dissipating structure may be a heat-dissipating fin. The speaker module provided by the present invention has a favorable heat dissipation performance, and is capable of duly transferring heat generated by the speaker during operation to the outside of the module.