公开(公告)号：US20240414866A1

公开(公告)日：2024-12-12

申请号：US18578886

申请日：2022-09-06

Applicant: GOERTEK INC.

Inventor： Shuo YANG ,  Zhiyuan DU ,  Bo MI

IPC: H05K5/06 ,  H05K5/00

Abstract: Disclosed are an electronic device housing including a casing and a seal, and an electronic device. The casing has an interior provided with an accommodating cavity configured to accommodate electronic device components, and a casing wall provided with a mounting cavity configured to mount the seal. The casing includes first and second through holes. The first and second through holes communicates the mounting cavity with the accommodating cavity and an outside, respectively. The seal includes a sealing part and a fixing part connected thereto. The fixing part is fixed to the casing wall, and the sealing part blocks the first through hole. The sealing part has elasticity. When pressure in the accommodating cavity is greater than that of the outside, at least part of the sealing part is separated from the first through hole, such that the accommodating cavity communicates with the mounting cavity to communicate with the outside.