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公开(公告)号：US20250028173A1
公开(公告)日：2025-01-23
申请号：US18353590
申请日：2023-07-17
Applicant: Google LLC
Inventor： Saeid Rezaei , Daniel Corbalan , Andrew Logan , Jiwon Yang , Han Zhang
Abstract: A cover is described for use in protecting near infrared sensors mounted to an augmented reality headset. Manufacturing the cover includes a polycarbonate injection molding process followed by a multi-coating deposition process. Contours of the sensor apparatus can be masked prior to the deposition to improve yield.
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