公开(公告)号：US09927834B2

公开(公告)日：2018-03-27

申请号：US15317116

申请日：2014-07-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Chanh V Hua ,  Michael Sterns ,  Kevin D Conn ,  Pinche Tsai

IPC: G06F1/16 ,  H01R12/75 ,  H01R12/72

CPC classification number: G06F1/16 ,  G06F1/185 ,  H01R12/721

Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.