公开(公告)号：US20210229440A1

公开(公告)日：2021-07-29

申请号：US16958578

申请日：2019-04-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W CUMBIE ,  David J BENSON ,  Randy HOFFMAN ,  Amy GAULT

IPC: B41J2/14

Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of aback surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.