公开(公告)号：US20220176629A1

公开(公告)日：2022-06-09

申请号：US17680661

申请日：2022-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11642847B2

公开(公告)日：2023-05-09

申请号：US17680661

申请日：2022-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

CPC classification number: B29C64/245 ,  B29C64/321 ,  B33Y30/00 ,  B33Y40/00

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11377302B2

公开(公告)日：2022-07-05

申请号：US16081803

申请日：2016-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Gerard Mosquera ,  Albert Iglesias Millan ,  Joan Mach

IPC: B65G27/18 ,  B65G27/04 ,  B29C64/329 ,  B33Y40/00

Abstract: In one example, an article for distributing powder includes a plate having holes therein through which a powder may pass from a first side of the plate to a second side of the plate opposite the first side and multiple ramps each intersecting the plate at one or multiple holes and sloping away from the first side of the plate in a first direction at an angle less than 90°.

公开(公告)号：US20200290274A1

公开(公告)日：2020-09-17

申请号：US16084141

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11285668B2

公开(公告)日：2022-03-29

申请号：US16084141

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US20210214167A1

公开(公告)日：2021-07-15

申请号：US16081803

申请日：2016-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Gerard Mosquera ,  Albert Iglesias Millan ,  Joan Mach

IPC: B65G27/18 ,  B29C64/329 ,  B65G27/04

Abstract: In one example, an article for distributing powder includes a plate having holes therein through which a powder may pass from a first side of the plate to a second side of the plate opposite the first side and multiple ramps each intersecting the plate at one or multiple holes and sloping away from the first side of the plate in a first direction at an angle less than 90°.