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公开(公告)号：US11155085B2
公开(公告)日：2021-10-26
申请号：US16619156
申请日：2017-07-17
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Stanley J Wang , Erik D Torniainen , Vincent C Korthuis
Abstract: A thermal fluid ejection heating element may include a first conductive trace, and an at least partially perforated resistive thin film material electrically coupling the first conductive trace to a second conductive trace. The perforations within the perforated resistive thin film material defines a resistance of the thermal fluid ejection heating element.
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