SPEAKER MODULE AND ELECTRONIC DEVICE
    1.
    发明公开

    公开(公告)号:US20240340577A1

    公开(公告)日:2024-10-10

    申请号:US18578439

    申请日:2022-12-22

    CPC classification number: H04R1/288 H04R1/021 H04R1/025 H04R9/06 H04R2499/11

    Abstract: This application provides a speaker module and an electronic device, and the electronic device includes a speaker module. The speaker module includes a shell, a vibration assembly, and a damping film, where the vibration assembly is mounted in an inner portion of the shell, the vibration assembly divides the inner portion of the shell into a front cavity and a back cavity, the shell is provided with a through hole, the through hole is communicated with the front cavity and the back cavity, and the damping film is mounted in the inner portion of the shell and covers the through hole, where an elastic modulus of the damping film is less than an elastic modulus of the vibration assembly.

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