公开(公告)号：US10607913B2

公开(公告)日：2020-03-31

申请号：US15797549

申请日：2017-10-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： HuiLi Fu ,  Shujie Cai ,  Feiyu Luo

IPC: H01L23/36 ,  H01L23/367 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00

Abstract: The present invention provide an IC die, including an underlay; an active component; an interconnection layer, covering the active component, where the interconnection layer includes multiple metal layers and multiple dielectric layers, the multiple metal layers and the multiple dielectric layers are alternately arranged, a metal layer whose distance to the active component is the farthest in the multiple metal layers includes metal cabling and a metal welding pad; and a heat dissipation layer, where the heat dissipation layer covers a region above the interconnection layer except a position corresponding to the metal welding pad, the heat dissipation layer is located under a package layer, the package layer includes a plastic packaging material, and the heat dissipation layer includes an electrical-insulating material whose heat conductivity is greater than a preset value.