公开(公告)号：US20240008167A1

公开(公告)日：2024-01-04

申请号：US18254737

申请日：2021-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lan LI ,  Linfang JIN ,  Jinyan HU

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0206 ,  H05K1/144 ,  H05K2201/042

Abstract: An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.