公开(公告)号：US20240405007A1

公开(公告)日：2024-12-05

申请号：US18802455

申请日：2024-08-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei ZHANG ,  Zunmiao CHEN ,  Lin SHI ,  Bo LIU ,  Jing WANG ,  Guicheng FAN

IPC: H01L25/16 ,  H01L23/00 ,  H05K1/18

Abstract: This application provides a system-in package component, an electronic device, and a system-in package component manufacturing method, to improve compatibility flexibility of a PCB with a component, reduce an area of the PCB, and reduce costs of the PCB. The system-in package component includes: a first carrier board; a plurality of electronic components, separately disposed on the first carrier board, where the first carrier board is configured to implement an electrical connection between at least two electronic components of the plurality of electronic components, and at least one electronic component of the plurality of electronic components includes a packaged integrated circuit; and a packaging material, configured to package the plurality of electronic components on the first carrier board.