公开(公告)号：US20200245499A1

公开(公告)日：2020-07-30

申请号：US16849445

申请日：2020-04-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiang LI ,  Jun WANG ,  Lirui JIA

IPC: H05K7/20

Abstract: A heat dissipation structure is disclose, the structure includes a housing, a first air vent and a second air vent. There is a gap between two neighboring side panels, and the 2N inner-layer side panels are grouped into N groups of inner-layer side panels in an arrangement sequence. A first gap between a first inner-layer and an outer-layer side panel communicates with the inside of the cabinet, or a first gap between two neighboring inner-layer side panels in different groups and a first gap between a first inner-layer and the outer-layer side panel communicate with each other, and communicate with the inside of the cabinet, to form an internal circulation ventilation channel. Second gaps, each of which is between two inner-layer side panels in a same group, communicate with each other, and communicate with the first and the second air vent, to form an external circulation ventilation channel.