公开(公告)号：US11621122B2

公开(公告)日：2023-04-04

申请号：US16797374

申请日：2020-02-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Peng Zou ,  Xiaojuan Cui ,  Tao Xiong

IPC: H01F27/32 ,  H01F27/28 ,  H01F41/04

Abstract: The present disclosure relates to inductor structures and fabricating methods. One example inductor structure includes a first magnetic material layer, an insulation layer, where the insulation layer comprises a polymer structure with longitudinal length which greater than lateral length, the polymer structure comprises an arched upper surface, a first side surface, a second side surface, a bottom surface in a longitudinal direction, at least one of a corner between the arched upper surface and the first side surface and a corner between the arched upper surface and the second side surface is a rounded corner, and at least one of an angle formed between the first side surface and the bottom surface and an angle formed between the second side surface and the bottom surface is less than 90 degree, at least one conductive wire structure passing through the insulation layer, and a second magnetic material layer.